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revisions ltr description date (yr-mo-da) approved e added device type 06 for vendor cages 54230 and 88379. added vendor cage 0eu86 for device types 01 through 06. figure 1, changed case outline m to reflect package is available in either a single or dual cavity. -sld 99-05-14 k. a. cottongim f added case outline 9. 00-04-06 raymond monnin g added device types 07, 08, and 09 for vendor cage 0eu86. made changes to table i to include the addition of device types 07, 08, and 09. added a min limit to the table i for the i li , and the i lo tests. made changes to figures 2, 3, 4, 5, 6, and 8. -sld 02-01-31 raymond monnin h added case outline z. updated paragr aph 1.2.4, 1.3, figures 1, 2, and 8. -sld 02-06-04 raymond monnin rev h sheet 35 rev h h h h h h h h h h h h h h h h h h h h sheet 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 rev status rev h h h h h h h h h h h h h h of sheets sheet 1 2 3 4 5 6 7 8 9 10 11 12 13 14 pmic n/a prepared by gary zahn defense supply center columbus standard microcircuit drawing checked by michael c. jones post office box 3990 columbus, ohio 43216-5000 approved by kendall a. cottongim microcircuit, hybrid, memory, digital, 128k x 32-bit, electrically erasable/programmabl e read only memory drawing approval date 94-08-02 this drawing is available for use by all departments and agencies of the department of defense amsc n/a revision level h size a cage code 67268 5962-94585 sheet 1 of 35 dscc form 2233 apr 97 5962-e373-02 distribution statement a . approved for public release; distribution is unlimited.
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 2 dscc form 2234 apr 97 1. scope 1.1 scope . this drawing documents five product assurance cl asses as defined in paragraph 1.2.3 and mil-prf-38534. a choice of case outlines and lead finishes which are available and are reflected in the part or identifying number (pin). when available, a choice of radiation hardness a ssurance levels are reflected in the pin. 1.2 pin . the pin shall be as shown in the following example: 5962 - 94585 01 h m x ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? federal rha device device case lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) \ / (see 1.2.3) \/ drawing number 1.2.1 radiation hardness assurance (rha) designator . rha marked devices shall meet the mil-prf-38534 specified rha levels and shall be marked with the appropriate rha designator. a dash (-) indicates a non-rha device. 1.2.2 device type(s) . the device type(s) identify the circuit function as follows: device type generic number circuit function access time 01 we128k32-300hq, act- e128k32n-300p7q, as8e 128k32-300/883c eeprom, 128k x 32-bit 300 ns 02 we128k32-250hq, act- e128k32n-250p7q, as8e 128k32-250/883c eeprom, 128k x 32-bit 250 ns 03 we128k32-200hq, act- e128k32n-200p7q, as8e 128k32-200/883c eeprom, 128k x 32-bit 200 ns 04 we128k32-150hq, act- e128k32n-150p7q, as8e 128k32-150/883c eeprom, 128k x 32-bit 150 ns 05 we128k32-140hq, act- e128k32n-140p7q, as8e 128k32-140/883c eeprom, 128k x 32-bit 140 ns 06 we128k32-120hq, act- e128k32n-120p7q, as8e 128k32-120/883c eeprom, 128k x 32-bit 120 ns 07 as8er128k32q-250/883c eepr om, 128k x 32-bit 250 ns 08 as8er128k32q-200/883c eepr om, 128k x 32-bit 200 ns 09 as8er128k32q-150/883c eeprom , 128k x 32-bit 150 ns 1.2.3 device class designator . this device class designator shall be a single letter identifying the product assurance level. all levels are defined by the requirement s of mil-prf-38534 and require qml certification as well as qualification (class h, k, and e) or qml listing (class g and d). the product assurance levels are as follows: device class device performance documentation k highest reliability class available. this level is intended for use in space applications. h standard military quality class level. this level is intended for use in applications where non-space high reliabilit y devices are required. g reduced testing version of the standard milit ary quality class. this level uses the class h screening and in-process inspections with a possible limited temperature range, manufacturer specified incoming fl ow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (group a, b, c and d). e designates devices which are based upon one of the other classes (k, h, or g) with exception(s) taken to the requirements of that class. these exception(s) must be specified in the device acquisition doc ument; therefore the acquisition document should be reviewed to ensure that the except ion(s) taken will not adversely affect system performance.
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 3 dscc form 2234 apr 97 d manufacturer specified quality class. q uality level is defined by the manufacturers internal, qml certified flow. this product may have a limited temperature range. 1.2.4 case outline(s) . the case outline(s) shall be as designated in mil-std-1835 and as follows: outline letter descriptive designator terminals package style m see figure 1 68 ceramic, single/dual cavity, quad flatpack n see figure 1 68 ceramic, single cavity, quad flatpack t see figure 1 66 hex-in-line, single cavity, with standoffs u see figure 1 66 hex-in-line, single cavity, without standoffs x see figure 1 66 hex-in-line, single cavity, with standoffs y see figure 1 66 hex-in-line, single cavity, without standoffs 4 see figure 1 66 1.075", hex-in-line, single cavity, with standoffs 5 see figure 1 66 1.075", hex-in-line, single cavity, with standoffs 6 see figure 1 66 1.075", hex-in-line, single cavity, with standoffs 9 see figure 1 68 ceramic, single cavity, quad flatpack z see figure 1 68 ceramic, dual cavity, quad flatpack 1.2.5 lead finish . the lead finish shall be as specified in mil-prf-38534. 1.3 absolute maximum ratings . 1 / supply voltage range (v cc )........................................................ -0.6 v to +6.25 v input voltage range.................................................................... -0 .6 v to +6.25 v power dissipation (p d )............................................................... 1.4 w storage temperature range ....................................................... -65 c to +150 c lead temperature (solderi ng, 10 seconds )................................ +300 c thermal resistance junction-to-case ( jc ): case outlines t, x, u, and y.................................................. 6.2 c/w case outline m and z ............................................................. 9.4 c/w case outline n ....................................................................... 3.1 c/w case outlines 4, 5, and 6 ....................................................... 2.7 c/w case outline 9 ........................................................................ 1.79 c/w data retention............................................................................ 10 years minimum endurance ................................................................................. 10,000 cycles minimum 2 / 1.4 recommended operating conditions . supply voltage range (v cc )........................................................ +4.5 v dc to +5.5 v dc input low voltage range (v il )...................................................... -0.5 v dc to +0.8 v dc input high voltage range (v ih ): device types 01 through 06 ................................................... +2.0 v dc to v cc + 0.3 v dc device types 07 through 09 ................................................... +2.2 v dc to v cc + 0.3 v dc output voltage, high minimum (v oh )......................................... +2.4 v dc output voltage, low maximum (v ol ) .......................................... +0.45 v dc case operating temperature range (t c ) .................................... -55 c to +125 c 1 / stresses above the absolute maximum rating may cause permanent damage to the device. extended operation at the maximum levels may degrade performance and affect reliability. 2 / device types 7 through 9 for page mode writes only.
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 4 dscc form 2234 apr 97 2. applicable documents 2.1 government specification, standards, and handbooks . the following specification, standards, and handbooks form a part of this drawing to the extent specified herein. unless ot herwise specified, the issues of these documents are those liste d in the issue of the department of defense i ndex of specifications and standards (dodi ss) and supplement thereto, cited in the solicitation. specification department of defense mil-prf-38534 - hybrid microcircu its, general specification for. standards department of defense mil-std-883 - test method standard microcircuits. mil-std-1835 - interface standard fo r electronic component case outlines. handbooks department of defense mil-hdbk-103 - list of standard microcircuit drawings. mil-hdbk-780 - standard microcircuit drawings. (unless otherwise indicated, copies of the specificat ion, standards, and handbooks are ava ilable from the standardization document order desk, 700 robbins avenue, building 4d, philadelphia, pa 19111-5094.) 2.2 order of precedence . in the event of a conflict between the text of th is drawing and the references cited herein, the text of this drawing takes precedence. nothing in this docum ent, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. requirements 3.1 item requirements . the individual item performance requirements fo r device classes d, e, g, h, and k shall be in accordance with mil-prf-38534. compliance with mil-prf- 38534 may include the performance of all tests herein or as designated in the device manufacturer's quality management (qm) plan or as designated for the applicable device class. therefore, the tests and inspections herein may not be per formed for the applicable device class (see mil-prf-38534). furthermore, the manufacturers may take exceptions or use alternate methods to the tests and inspections herein and not perform them. however, the performanc e requirements as defined in mil-prf-38534 shall be met for the applicable device class. 3.2 design, construction, and physical dimensions . the design, construction, and physica l dimensions shall be as specified in mil-prf-38534 and herein. 3.2.1 case outline(s) . the case outline(s) shall be in a ccordance with 1.2.4 herein and figure 1. 3.2.2 terminal connections . the terminal connections sha ll be as specified on figure 2. 3.2.3 truth table(s) . the truth table(s) shall be as specified on figure 3. 3.2.4 timing diagram(s) . the timing diagram(s) shall be as s pecified on figures 4, 5, 6, and 7. 3.2.5 block diagram . the block diagram shall be as specified on figure 8. 3.2.5 typical output test circuit . the typical output test circuit shall be as specified on figure 9. 3.3 electrical perfo rmance characteristics . unless otherwise specified herein, the electrical performance characteristics are as specified in table i and shall apply over the full specified operat ing temperature range.
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 5 dscc form 2234 apr 97 3.4 electrical test requirements . the electrical test requirements shall be the subgroups specified in t able ii. the electrical tests for each subgroup are described in table i. 3.5 programming procedure. the programming procedure shall be as specif ied by manufacturer and shall be available on request. 3.6 marking of device(s) . marking of device(s) shall be in accordance wi th mil-prf-38534. the device shall be marked with the pin listed in 1.2 herein. in addition, the manufacturer's vendor similar pin may also be marked as listed in mil-hdbk-103 and qml-38534. 3.7 data . in addition to the general performance requirements of mil-prf-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables fo rmat) from the initial quality c onformance inspection group a lot sample, for each device type listed herein. also, the data shoul d include a summary of all parameters manually tested, and for those which, if any, are guaranteed. this data shall be mainta ined under document revision level control by the manufacturer and be made available to the preparing activity (dscc-va) upon request. 3.8 certificate of compliance . a certificate of compliance shall be required fr om a manufacturer in or der to supply to this drawing. the certificate of compliance (o riginal copy) submitted to dscc-va shall a ffirm that the manufacturer's product meets the performance requirements of mil-prf-38534 and herein. 3.9 certificate of conformance . a certificate of conformance as required in mil-prf-38534 shall be provided with each lot of microcircuits delivered to this drawing. 3.10 endurance . a reprogrammability test shall be completed as part of the vendor's reliability monitors. this reprogrammability test shall be done for the initial characterization and after any desi gn or process changes which may affect the reprogrammability of the device. the methods and procedures may be vendor s pecific, but shall guarantee the number of program/erase endurance cycles listed in se ction 1.3 herein over the full specified operating temperature range. the vendor's procedure shall be kept under document cont rol and shall be made available upon request of the acquiring or preparing activity. 3.11 data retention . a data retention stress test shall be completed as par t of the vendor's reliability monitors. this test shall be done for initial characterization and after any design or proc ess change which may affect data retention. the methods and procedures may be vendor specific, but sha ll guarantee the number of years listed in se ction 1.3 herein over the full military temperature range. the vendor's procedur e shall be kept under document control and shall be made available upon request of the acquiring or preparing activity.
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 6 dscc form 2234 apr 97 table i. electrical per formance characteristics . limits test symbol conditions 1 / 2 / -55 c t c +125 c +4.5 v dc v cc +5.5 v dc unless otherwise specified group a subgroups device types min max unit dc parameters supply current i cc cs = v il , oe = we = v ih , i/o 0 through i/o 31 = open. inputs = v cc = +5.5 v dc, a0 through a16 change at f = 5 mhz cmos levels. 1,2,3 all 250 ma standby current i sb cs = v cc , oe = v ih , i/o 0 through i/o 31 = open. inputs = v cc = +5.5 v dc, a0 through a16 change at f = 5 mhz cmos levels. 1,2,3 all 5 ma input leakage current i li v in = v ss to v cc 1,2,3 all -10 +10 a input leakage ( res pin) i il (res) v in = v ss to v cc 1,2,3 7,8,9 -500 +500 a output leakage current i lo cs = v ih , v out = v ss to v cc 1,2,3 all -10 +10 a input low voltage v il 1,2,3 all 0.8 v 1-6 2.0 input high voltage v ih 1,2,3 7-9 2.2 v input high voltage res signal v h 1,2,3 7-9 v cc -.5 v v cc +1v v output low voltage v ol v cc = +4.5 v dc, i ol = 2.1 ma 1,2,3 all 0.45 v output high voltage v oh v cc = +4.5 v dc, i ol = -400 a 1,2,3 all 2.4 v capacitance a0 - a16 3 / oe capacitance 3 / c ad c oe v in = 0 v dc, f = 1.0 mhz, t a = +25 c 4 all 50 pf 1 cs -4 capacitance 3 / c cs v in = 0 v dc, f = 1.0 mhz, t a = +25 c 4 all 20 pf 1 we -4 capacitance 3 / c we1-4 v in = 0 v dc, f = 1.0 mhz, t a = +25 c 4 all 20 pf see footnotes at end of table.
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 7 dscc form 2234 apr 97 table i. electrical per formance characteristics - continued. limits test symbol conditions 1 / 2 / -55 c t c +125 c +4.5 v dc v cc +5.5 v dc unless otherwise specified group a subgroups device types min max unit capacitance - continued. we capacitance 3 / c we v in = 0 v dc, f = 1.0 mhz, t a = +25 c case outline n, only. 4 all 50 pf i/o0-i/o31 capacitance 3 / c i/o v out = 0 v dc, f = 1.0 mhz, t a = +25 c 4 all 20 pf res and rdy/ busy capacitance c res c rdy res = rdy/ busy = 0 v 4 7,8,9 50 pf functional tests functional tests see 4.3.1c 7,8a,8b all read cycle timing characteristics read cycle timing t rc see figure 4. 9,10,11 01 02,07 03,08 04,09 05 06 300 250 200 150 140 120 ns address access timing t acc see figure 4. 9,10,11 01 02,07 03,08 04,09 05 06 300 250 200 150 140 120 ns chip select access timing t acs see figure 4. 9,10,11 01 02,07 03,08 04,09 05 06 300 250 200 150 140 120 ns output hold from address change oe or cs t oh see figure 4. 9,10,11 all 0 ns see footnotes at end of table.
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 8 dscc form 2234 apr 97 table i. electrical per formance characteristics - continued. limits test symbol conditions 1 / 2 / -55 c t c +125 c +4.5 v dc v cc +5.5 v dc unless otherwise specified group a subgroups device types min max unit read cycle timing characteristics - continued. out enable to output valid t oe see figure 4. 9,10,11 01 02,07 03,08 04,05 06 09 0 0 0 0 0 0 125 100 85 55 50 75 ns 01-06 70 chip select or output enable to output high - z 3 / t df see figure 4. 9,10,11 07-09 50 ns byte write ac timing characteristics. 01-06 10 address setup time t as see figure 5. 9,10,11 07-09 0 ns 01-06 150 write pulse width t wp see figure 5. 9,10,11 07-09 250 ns chip select setup time t cs see figure 5. 9,10,11 all 0 ns 01-06 100 address hold time t ah see figure 5. 9,10,11 07-09 150 ns 01-06 4 output enable setup time t oes see figure 5. 9,10,11 07-09 0 ns data hold time t dh see figure 5. 9,10,11 all 10 ns 01-06 10 output enable hold time t oeh see figure 5. 9,10,11 07-09 0 ns data setup time t ds see figure 5. 9,10,11 all 100 ns chip select hold time t csh see figure 5. 9,10,11 all 0 ns 01-06 50 write pulse width high t wph see figure 5. 9,10,11 07-09 300 ns write cycle time t wc see figure 5. 9,10,11 all 10 ms see footnotes at end of table
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 9 dscc form 2234 apr 97 table i. electrical per formance characteristics - continued. limits test symbol conditions 1 / 2 / -55 c t c +125 c +4.5 v dc v cc +5.5 v dc unless otherwise specified group a subgroups device types min max unit page mode write ac timing characteristics. data setup time t ds see figure 6. 9,10,11 all 100 ns data hold time t dh see figure 6. 9,10,11 all 10 ns 01-06 150 write pulse width t wp see figure 6. 9,10,11 07-09 250 ns 01-06 150 byte load cycle time t blc see figure 6. 9,10,11 07-09 30 s 01-06 50 write pulse width high t wph see figure 6. 9,10,11 07-09 300 ns write cycle time t wc see figure 6. 9,10,11 all 10 ms data polling ac timing characteristics. 3 / data hold time t dh see figure 7. 9,10,11 all 10 ns output enable hold time t oeh see figure 7. 9,10,11 all 10 ns output enable to output delay t oe see figure 7. 9,10,11 all 100 ns write recovery time t wr see figure 7. 9,10,11 all 0 ns res low to output float t dfr see figure 4. 9,10,11 07-09 0 350 ns res to output delay t rr see figure 4. 9,10,11 07-09 0 450 ns reset protect time t rp see figures 5 and 6. 9,10,11 07-09 100 s reset high time t res see figures 5 and 6. 9,10,11 07-09 1.0 s time to device busy t db see figures 5 and 6. 9,10,11 07-09 120 ns 1 / unless otherwise specified, the ac test conditions are as follows: input pulse levels: v il = 0 v and v ih = 3.0 v. input rise and fall times: 5 nanoseconds. input and output timing reference level: 1.5 v. 2 / res and rdy/ busy functions are applicable for device types 07 through 09 only. 3 / guaranteed by design, but not tested.
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 10 dscc form 2234 apr 97 case outline m. figure 1. case outline(s) .
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 11 dscc form 2234 apr 97 case outline m - continued. millimeters inches symbol min max min max a 3.12 5.08 .123 .200 a1 2.30 4.72 .118 .186 a2 0.00 0.51 .000 .020 b 0.33 0.43 .013 .017 b 0.25 ref .010 ref d/e 20.32 bsc .800 bsc d1/e1 22.10 22.61 .870 .890 d2/e2 24.89 25.40 .980 1.000 d3/e3 23.77 24.28 .936 .956 e 1.27 bsc .050 bsc r 0.13 .005 l1 0.89 1.14 .035 .045 notes: 1. the u.s. preferred system of m easurement is the metric si. this it em was designed using inch-pound units of measurement. in case of problems involving conf licts between the metric and inch-pound units, the inch-pound units shall rule. 2. pin numbers are for reference only. 3. case outline m may either be a single cavity or a dual cavity package. figure 1. case outline(s) - continued.
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 12 dscc form 2234 apr 97 case outline n. millimeters inches symbol min max min max a 4.45 5.08 .175 .200 a1 1.52 bsc .060 bsc a2 1.14 1.39 .045 .055 b 0.31 0.46 .012 .018 c 0.23 0.31 .009 .012 d/e 63.63 66.42 2.505 2.615 d1/e1 39.24 40.01 1.545 1.575 d2/e2 73.28 84.20 2.885 3.315 e 1.27 bsc .050 bsc e1 20.32 bsc .800 bsc j 4.83 5.33 .190 .210 k 37.72 38.48 1.485 1.515 l 12.19 13.21 .480 .520 s1 9.65 bsc .380 bsc notes: 1. the u.s. preferred system of measurement is the metric si. this item was designed using inch-pound units of measurement. in case of problems invo lving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. pin numbers are for reference only. figure 1. case outline(s) - continued.
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 13 dscc form 2234 apr 97 case outlines t, x, 4, 5, and 6. figure 1. case outline(s) - continued.
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 14 dscc form 2234 apr 97 case outlines t and x - continued. millimeters inches symbol min max min max a 5.33 6.22 .210 .245 a1 0.64 0.89 .025 .035 a2 3.42 3.68 .135 .145 ?b 0.41 0.51 .016 .020 ?b1 1.14 1.40 .045 .055 ?b2 1.65 1.91 .065 .075 d/e 29.72 30.48 1.170 1.200 d1/e1 25.40 bsc 1.000 bsc d2 15.24 bsc .600 bsc d3 28.96 29.21 1.140 1.150 e 2.54 bsc .100 bsc l 3.68 3.94 .145 .155 case outlines 4, 5, and 6 - continued. millimeters inches symbol min max min max a 3.43 4.60 .135 .181 a1 0.64 0.89 .025 .035 ?b 0.41 0.51 .016 .020 ?b1 1.14 1.40 .045 .055 ?b2 1.65 1.91 .065 .075 d/e 27.05 27.56 1.065 1.085 d1/e1 25.40 bsc 1.000 bsc d2 15.24 bsc .600 bsc d3 25.90 26.92 1.020 1.060 e 2.54 bsc .100 bsc l 3.35 3.94 .132 .155 notes: 1. the u.s. preferred system of m easurement is the metric si. this it em was designed using inch-pound units of measurement. in case of problems involving conf licts between the metric and inch-pound units, the inch-pound units shall rule. 2. pin 1 is identified by .070 inch (1.78 mm) square pad. 3. pin numbers are for reference only. figure 1. case outline(s) - continued.
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 15 dscc form 2234 apr 97 case outlines u and y. millimeters inches symbol min max min max a 4.70 5.84 .185 .230 a1 0.13 0.51 .005 .020 a2 3.42 3.68 .135 .145 ?b 0.41 0.51 .016 .020 ?b1 0.76 1.52 .030 .060 ?b2 1.65 1.91 .065 .075 d/e 29.72 30.48 1.170 1.200 d1/e1 25.40 bsc 1.000 bsc d2 15.24 bsc .600 bsc d3 28.96 29.21 1.140 1.150 e 2.54 bsc .100 bsc l 4.19 4.70 .165 .185 notes: 1. the u.s. preferred system of m easurement is the metric si. this it em was designed using inch-pound units of measurement. in case of problems involving conf licts between the metric and inch-pound units, the inch-pound units shall rule. 2. pin 1 is identified by .070 inch (1.78 mm) square pad. 3. pin numbers are for reference only. figure 1. case outline(s) - continued.
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 16 dscc form 2234 apr 97 case outline 9. millimeters inches symbol min max min max a 3.56 .140 a1 2.79 .110 a2 0.46 0.76 .018 .030 b 0.33 0.43 .013 .017 c 0.15 0.25 .006 .010 d/e 20.32 bsc .800 bsc d1/e1 23.65 24.10 .931 .949 d2/e2 25.15 25.40 .990 1.000 e 1.27 bsc .050 bsc l1 0.51 1.14 .020 .045 notes: 1. the u.s. preferred system of measurement is the metric si. this item was designed using inch-pound units of measurement. in case of problems involving c onflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. pin numbers are for reference only. figure 1. case outline(s) - continued.
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 17 dscc form 2234 apr 97 case outline z. figure 1. case outline(s) -continued.
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 18 dscc form 2234 apr 97 case z - continued. millimeters inches symbol min max min max a 3.12 5.08 .123 .200 a1 3.00 4.72 .118 .186 a2 0.00 0.51 .000 .020 b 0.33 0.43 .013 .017 c 0.23 0.31 .009 .012 d/e 27.58 28.30 1.086 1.114 d1/e1 22.10 22.61 .870 .890 d2/e2 48.77 50.80 1.920 2.000 e 1.27 bsc .050 bsc e1 20.32 bsc .800 bsc j 4.95 5.21 .195 .205 k 22.73 22.99 .895 .905 l 8.00 8.26 .315 .325 r 0.13 .005 s1 1.02 bsc .040 bsc notes: 1. the u.s. preferred system of measurement is the metric si. this item was designed using inch-pound units of measurement. in case of problems involving c onflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. pin numbers are for reference only. figure 1. case outline(s) - continued.
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 19 dscc form 2234 apr 97 device types 1-6 device types 1-6 device types 1-6 device types 1-6 case outlines m, 9 case outlines m, 9 case outlines m, 9 case outlines m, 9 terminal number terminal symbol terminal number terminal symbol terminal number terminal symbol terminal number terminal symbol 1 gnd 18 gnd 35 oe 52 gnd 2 3 cs 19 i/o8 36 2 cs 53 i/o23 3 a5 20 i/o9 37 nc 54 i/o22 4 a4 21 i/o10 38 2 we 55 i/o21 5 a3 22 i/o11 39 3 we 56 i/o20 6 a2 23 i/o12 40 4 we 57 i/o19 7 a1 24 i/o13 41 nc 58 i/o18 8 a0 25 i/o14 42 nc 59 i/o17 9 nc 26 i/o15 43 nc 60 i/o16 10 i/o0 27 v cc 44 i/o31 61 v cc 11 i/o1 28 a11 45 i/o30 62 a10 12 i/o2 29 a12 46 i/o29 63 a9 13 i/o3 30 a13 47 i/o28 64 a8 14 i/o4 31 a14 48 i/o27 65 a7 15 i/o5 32 a15 49 i/o26 66 a6 16 i/o6 33 a16 50 i/o25 67 1 we 17 i/o7 34 1 cs 51 i/o24 68 4 cs notes: 1. nc is no connection. 2. for case outline m, device types 07 through 09, pin 9 is res , pin 31 is a15, pin 32 is a14, and pin 43 is rdy/ busy . figure 2. terminal connections .
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 20 dscc form 2234 apr 97 device types 1-6 device types 1-6 device types 1-6 device types 1-6 case outline n case outline n case outline n case outline n terminal number terminal symbol terminal number terminal symbol terminal number terminal symbol terminal number terminal symbol 1 gnd 18 gnd 35 oe 52 gnd 2 1 cs 19 i/o8 36 4 cs 53 i/o23 3 a5 20 i/o9 37 nc 54 i/o22 4 a4 21 i/o10 38 nc 55 i/o21 5 a3 22 i/o11 39 nc 56 i/o20 6 a2 23 i/o12 40 nc 57 i/o19 7 a1 24 i/o13 41 nc 58 i/o18 8 a0 25 i/o14 42 nc 59 i/o17 9 nc 26 i/o15 43 nc 60 i/o16 10 i/o0 27 v cc 44 i/o31 61 v cc 11 i/o1 28 a11 45 i/o30 62 a10 12 i/o2 29 a12 46 i/o29 63 a9 13 i/o3 3 a13 47 i/o28 64 a8 14 i/o4 31 a14 48 i/o27 65 a7 15 i/o5 32 a15 49 i/o26 66 a6 16 i/o6 33 a16 50 i/o25 67 we 17 i/o7 34 2 cs 51 i/o24 68 3 cs note: nc is no connection. figure 2. terminal connections - continued.
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 21 dscc form 2234 apr 97 device types 1-6 device types 1-6 device types 1-6 device types 1-6 case outlines t,u,x,y, 4,5 case outlines t,u,x,y, 4,5 case outlines t,u,x,y, 4,5 case outlines t,u,x,y, 4,5 terminal number terminal symbol terminal number terminal symbol terminal number terminal symbol terminal number terminal symbol 1 i/o8 18 a12 35 i/o25 52 3 we 2 i/o9 19 v cc 36 i/o26 53 3 cs 3 i/o10 20 1 cs 37 a6 54 gnd 4 a13 21 nc 38 a7 55 i/o19 5 a14 22 i/03 39 nc 56 i/o31 6 a15 23 i/015 40 a8 57 i/o30 7 a16 24 i/o14 41 a9 58 i/o29 8 nc 25 i/o13 42 i/o16 59 i/o28 9 i/o0 26 i/o12 43 i/o17 60 a0 10 i/o1 27 oe 44 i/o18 61 a1 11 i/o2 28 nc 45 v cc 62 a2 12 2 we 29 1 we 46 4 cs 63 i/o23 13 2 cs 30 i/o7 47 4 we 64 i/o22 14 gnd 31 i/o6 48 i/o27 65 i/o21 15 i/o11 32 i/o5 49 a3 66 i/o20 16 a10 33 i/o4 50 a4 17 a11 34 i/o24 51 a5 note: case outlines t, u, and 4, pins 8, 21, 28, and 39 are no connects (nc) and for case outlines x, y, and 5, pins 8, 21, 28, and 39 are ground. figure 2. terminal connections - continued.
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 22 dscc form 2234 apr 97 device types 1-6 device types 1-6 device types 1-6 device types 1-6 case outline 6 case outline 6 case outline 6 case outline 6 terminal number terminal symbol terminal number terminal symbol terminal number terminal symbol terminal number terminal symbol 1 i/o8 18 a15 35 i/o25 52 3 we 2 i/o9 19 v cc 36 i/o26 53 3 cs 3 i/o10 20 1 cs 37 a7 54 gnd 4 a14 21 nc 38 a12 55 i/o19 5 a16 22 i/03 39 nc 56 i/o31 6 a11 23 i/015 40 a13 57 i/o30 7 a0 24 i/o14 41 a8 58 i/o29 8 nc 25 i/o13 42 i/o16 59 i/o28 9 i/o0 26 i/o12 43 i/o17 60 a1 10 i/o1 27 oe 44 i/o18 61 a2 11 i/o2 28 nc 45 v cc 62 a3 12 2 we 29 1 we 46 4 cs 63 i/o23 13 2 cs 30 i/o7 47 4 we 64 i/o22 14 gnd 31 i/o6 48 i/o27 65 i/o21 15 i/o11 32 i/o5 49 a4 66 i/o20 16 a10 33 i/o4 50 a5 17 a9 34 i/o24 51 a6 note: nc is no connection. figure 2. terminal connections - continued.
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 23 dscc form 2234 apr 97 device types 7-9 device types 7-9 device types 7-9 device types 7-9 case outline m, z case outline m, z case outline m, z case outline m, z terminal number terminal symbol terminal number terminal symbol terminal number terminal symbol terminal number terminal symbol 1 gnd 18 gnd 35 oe 52 gnd 2 3 cs 19 i/o8 36 2 cs 53 i/o23 3 a5 20 i/o9 37 nc 54 i/o22 4 a4 21 i/o10 38 2 we 55 i/o21 5 a3 22 i/o11 39 3 we 56 i/o20 6 a2 23 i/o12 40 4 we 57 i/o19 7 a1 24 i/o13 41 nc 58 i/o18 8 a0 25 i/o14 42 nc 59 i/o17 9 res 26 i/o15 43 rdy/ busy 60 i/o16 10 i/o0 27 v cc 44 i/o31 61 v cc 11 i/o1 28 a11 45 i/o30 62 a10 12 i/o2 29 a12 46 i/o29 63 a9 13 i/o3 30 a13 47 i/o28 64 a8 14 i/o4 31 a15 48 i/o27 65 a7 15 i/o5 32 a14 49 i/o26 66 a6 16 i/o6 33 a16 50 i/o25 67 1 we 17 i/o7 34 1 cs 51 i/o24 68 4 cs notes: 1. nc is no connection. 2. for case outline m, device types 01 through 06, pin 9 is a no connect, pin 31 is a14, pin 32 is a15, and pin 43 is a no connect. figure 2. terminal connections - continued.
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 24 dscc form 2234 apr 97 device types 01 through 06. cs oe we a0-a16 mode data i/o device current h x x x standby high z standby l l h stable read data out active l h l stable write data in active x h x x out disable high z active x x h x write inhibit active x l x x write inhibit active notes: 1. h = v ih = high logic level 2. l = v il = low logic level 3. x = do not care (either high or low) 4. high z = high impedance state device types 07 trough 09. mode cs oe we res rdy/ busy i/o read v il v il v ih v h high z d out standby v ih x x x high z high z write v il v ih v il v h high z to v ol d in deselect v il v ih v ih v h high z high z write inhibit x x v ih x --- --- write inhibit x v il x x --- --- data polling v il v il v ih v h v ol d out (i/o7) program reset x x x v il high z high z notes: 1. v ih = high logic "1" state. 2. v il = low logic "0" state. 3. x = "do not care" state. 4. high z = high impedance state. 5. d in = data in, d out = data out, and v h = v cc - 0.5 v to v cc +1.0 v. figure 3. truth table .
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 25 dscc form 2234 apr 97 note: res waveform is applicable for device types 07 through 09 only. figure 4. read cycle timing diagram .
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 26 dscc form 2234 apr 97 note: rdy/ busy , res and v cc waveforms are applicable for device types 07 through 09 only. figure 5. write cycle timing diagram we controlled .
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 27 dscc form 2234 apr 97 note: rdy/ busy , res and v cc waveforms are applicable for device types 07 through 09 only. figure 5. write cycle timing diagram cs controlled - continued.
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 28 dscc form 2234 apr 97 notes: 1. ao through a6 are used to address specific bytes within a page. 2. a7 through a16 must specify the sa me page address during each high to low trans ition of write enable or chip select. 3. rdy/ busy , res and v cc waveforms are applicable for device types 07 through 09 only. figure 6. page mode write timing diagram .
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 29 dscc form 2234 apr 97 figure 7. data polling ac timing diagram .
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 30 dscc form 2234 apr 97 case outlines m, t, u, x, y, 4, 5, 6, and 9. case outline n. figure 8. block diagram(s) .
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 31 dscc form 2234 apr 97 case outlines m and z, device types 07, 08, and 09 only. figure 8. block diagram - continued.
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 32 dscc form 2234 apr 97 notes: 1. v z is programmed from -2.0 v to +7.0 v. i oh and i ol are programmable from 0 to 16 ma. 2. tester impedance z o = 75 ohms 3. v z is typically the midpoint of v oh and v ol . 4. c l includes tester includes jig capacitance. figure 9. typical output test circuit .
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 33 dscc form 2234 apr 97 table ii. electrical test requirements . mil-prf-38534 test requirements subgroups (in accordance with mil-prf-38534, group a test table) interim electrical parameters 1,4,7,9 final electrical parameters 1*,2,3,4,7,8a,8b,9,10,11 group a test requirements 1,2,3,4,7,8a,8b,9,10,11 group c end-point electrical parameters 1,2,3,4,7,8a,8b,9,10,11 end-point electrical parameters for radiation hardness assurance (rha) devices not applicable * pda applies to subgroup 1. 4. quality assurance provisions 4.1 sampling and inspection . sampling and inspection procedures shall be in accordance with mil-prf-38534 or as modified in the device manufacturer's quality management (qm) pl an. the modification in the qm plan shall not affect the form, fit, or function as described herein. . 4.2 screening . screening shall be in accordance with mil-prf-38534, or by the manufacturer's quality management (qm) plan in accordance with appendix b of mil-prf-38534. the following additional criteria shall apply: a. burn-in test, method 1015 of mil-std-883. (1) test condition b. the test circuit shall be maintai ned by the manufacturer under document revision level control and shall be made available to either dscc-va or the acqui ring activity upon request. also, the test circuit shall specify the inputs, outputs, biases, and pow er dissipation, as applicable, in acco rdance with the intent specified in test method 1015 of mil-std-883. (2) t a as specified in accordance with table i of method 1015 of mil-std-883. b. interim and final electrical test parameters shall be as spec ified in table ii herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 conformance and periodic inspections . conformance inspection (ci) and periodi c inspection (pi) shall be in accordance with mil-prf-38534 and as specified herein.
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 34 dscc form 2234 apr 97 4.3.1 group a inspection (ci) . group a inspection shall be in accordance with mil-prf-38534 and as follows: a. tests shall be as specified in table ii herein. b. subgroups 5 and 6 shall be omitted. c. subgroups 7, 8a, and 8b shall incl ude verification of the truth table. d. the following data patterns shall be verified during subgroups 7, 8a, and 8b: (1) 0's to all memory cell locations. (2) 1's to all memory cell locations. (3) checkerboard pattern to entire memory array. (4) checkerboard compliment to entire memory array. 4.3.2 group b inspection (pi) . group b inspection shall be in accordance with mil-prf-38534. 4.3.3 group c inspection (pi) . group c inspection shall be in accordance with mil-prf-38534 and as follows: a. end-point electrical parameters shall be as specified in table ii herein. b. all devices requiring end-point electric al testing shall be programmed with a che ckerboard pattern of alternate rows of aa hex and 55 hex. c. steady-state life test, method 1005 of mil-std-883. (1) test condition b. the test circuit shall be maintai ned by the manufacturer under document revision level control and shall be made available to either dscc-va or the acqui ring activity upon request. also, the test circuit shall specify the inputs, outputs, biases, and pow er dissipation, as applicable, in acco rdance with the intent specified in test method 1005 of mil-std-883. (2) t a as specified in accordance with table i of method 1005 of mil-std-883. (3) test duration: 1,000 hours, except as permitted by method 1005 of mil-std-883. (4) the checkerboard data pattern shall be verified afte r burn-in as part of end-poi nt electrical testing. 4.3.4 group d inspection (pi) . group d inspection shall be in accordance with mil-prf-38534. 4.3.5 radiation hardness assurance (rha) insepction . rha inspection is currently not applicable to this drawing. 5. packaging 5.1 packaging requirements . the requirements for packaging shall be in accordance with mil-prf-38534.
standard microcircuit drawing size a 5962-94585 defense supply center columbus columbus, ohio 43216-5000 revision level h sheet 35 dscc form 2234 apr 97 6. notes 6.1 intended use . microcircuits conforming to this drawing are intended for use for gove rnment microcircuit applications (original equipment), design applic ations, and logistics purposes. 6.2 replaceability . microcircuits covered by this drawing will repl ace the same generic device covered by a contractor- prepared specification or drawing. 6.3 configuration control of smd's . all proposed changes to existing smd's will be coordinated with the users of record for the individual documents. this coordination w ill be accomplished in accordance with mil-prf-38534. 6.4 record of users . military and industrial users shall inform defens e supply center columbus when a system application requires configuration control and the applicable smd. dscc w ill maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. us ers of drawings covering micr oelectronic devices (fsc 5962) should contact dscc-va, telephone (614) 692-0544. 6.5 comments . comments on this drawing should be directed to dscc-va, post office box 3990, columbus, ohio 43216- 5000, or telephone (614) 692-1081. 6.6 sources of supply . sources of supply are listed in mil-hdbk- 103 and qml-38534. the vendors listed in mil-hdbk- 103 and qml-38534 have submitted a certificate of compliance (s ee 3.7 herein) to dscc-va and have agreed to this drawing.
standard microcircuit drawing bulletin date: 02-06-04 approved sources of supply for smd 5962-94585 are listed below for immediate acquisition information only and shall be added to mil-hdbk-103 and qml-38534 during the next re visions. mil-hdbk-103 and qml-38534 will be revised to include the addition or deletion of sources. the vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by dscc-va. this bulletin is superseded by the next dated revisions of mil-hdbk-103 and qml-38534. standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962-9458501hma 5962-9458501hmc 5962-9458501hma 5962-9458501hmc 5962-9458501hma 5962-9458501hmc 5962-9458501hnc 5962-9458501hta 5962-9458501htc 5962-9458501hua 5962-9458501huc 5962-9458501hxa 5962-9458501hxc 5962-9458501hya 5962-9458501hyc 5962-9458501h4a 5962-9458501h4c 5962-9458501h4a 5962-9458501h4c 5962-9458501h4a 5962-9458501h4c 5962-9458501h5a 5962-9458501h5c 5962-9458501h5a 5962-9458501h5c 5962-9458501h5a 5962-9458501h5c 5962-9458501h6a 5962-9458501h6c 5962-9458501h9a 5962-9458501h9c 0eu86 0eu86 54230 54230 88379 88379 54230 54230 54230 54230 54230 54230 54230 54230 54230 0eu86 0eu86 54230 54230 88379 88379 0eu86 0eu86 54230 54230 88379 88379 54230 54230 54230 54230 as8e128k32q-300/883c as8e128k32q-300/883c we128k32-300g2q we128k32-300g2q act-e128k32n-300f2q act-e128k32n-300f2q we128k32-300g4q we128k32n-300hq we128k32n-300hq we128k32n-300hq we128k32n-300hq we128k32-300hq we128k32-300hq we128k32-300hq we128k32-300hq as8e128k32pn-300/883c as8e128k32pn-300/883c we128k32n-300h1q we128k32n-300h1q act-e128k32n-300p7q act-e128k32n-300p7q as8e128k32p-300/883c as8e128k32p-300/883c we128k32-300h1q we128k32-300h1q act-e128k32c-300p7q act-e128k32c-300p7q we128k32np-300h1q we128k32np-300h1q we128k32-300g1uq we128k32-300g1uq see footnotes at end of table. 1 of 7
standard microcircuit drawing bulletin - continued. date: 02-06-04 standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962-9458502hma 5962-9458502hmc 5962-9458502hma 5962-9458502hmc 5962-9458502hma 5962-9458502hmc 5962-9458502hnc 5962-9458502hta 5962-9458502htc 5962-9458502hua 5962-9458502huc 5962-9458502hxa 5962-9458502hxc 5962-9458502hya 5962-9458502hyc 5962-9458502h4a 5962-9458502h4c 5962-9458502h4a 5962-9458502h4c 5962-9458502h4a 5962-9458502h4c 5962-9458502h5a 5962-9458502h5c 5962-9458502h5a 5962-9458502h5c 5962-9458502h5a 5962-9458502h5c 5962-9458502h6a 5962-9458502h6c 5962-9458502h9a 5962-9458502h9c 0eu86 0eu86 54230 54230 88379 88379 54230 54230 54230 54230 54230 54230 54230 54230 54230 0eu86 0eu86 54230 54230 88379 88379 0eu86 0eu86 54230 54230 88379 88379 54230 54230 54230 54230 as8e128k32q-250/883c as8e128k32q-250/883c we128k32-250g2q we128k32-250g2q act-e128k32n-250f2q act-e128k32n-250f2q we128k32-300g4q we128k32n-250hq we128k32n-250hq we128k32n-250hq we128k32n-250hq we128k32-250hq we128k32-250hq we128k32-250hq we128k32-250hq as8e128k32pn-250/883c as8e128k32pn-250/883c we128k32n-250h1q we128k32n-250h1q act-e128k32n-250p7q act-e128k32n-250p7q as8e128k32p-250/883c as8e128k32p-250/883c we128k32-250h1q we128k32-250h1q act-e128k32c-250p7q act-e128k32c-250p7q we128k32np-250h1q we128k32np-250h1q we128k32-250g1uq we128k32-250g1uq see footnotes at end of table. 2 of 7
standard microcircuit drawing bulletin - continued. date: 02-06-04 standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962-9458503hma 5962-9458503hmc 5962-9458503hma 5962-9458503hmc 5962-9458503hma 5962-9458503hmc 5962-9458503hnc 5962-9458503hta 5962-9458503htc 5962-9458503hua 5962-9458503huc 5962-9458503hxa 5962-9458503hxc 5962-9458503hya 5962-9458503hyc 5962-9458503h4a 5962-9458503h4c 5962-9458503h4a 5962-9458503h4c 5962-9458503h4a 5962-9458503h4c 5962-9458503h5a 5962-9458503h5c 5962-9458503h5a 5962-9458503h5c 5962-9458503h5a 5962-9458503h5c 5962-9458503h6a 5962-9458503h6c 5962-9458503h9a 5962-9458503h9c 0eu86 0eu86 54230 54230 88379 88379 54230 54230 54230 54230 54230 54230 54230 54230 54230 0eu86 0eu86 54230 54230 88379 88379 0eu86 0eu86 54230 54230 88379 88379 54230 54230 54230 54230 as8e128k32q-200/883c as8e128k32q-200/883c we128k32-200g2q we128k32-200g2q act-e128k32n-200f2q act-e128k32n-200f2q we128k32-300g4q we128k32n-200hq we128k32n-200hq we128k32n-200hq we128k32n-200hq we128k32-200hq we128k32-200hq we128k32-200hq we128k32-200hq as8e128k32pn-200/883c as8e128k32pn-200/883c we128k32n-200h1q we128k32n-200h1q act-e128k32n-200p7q act-e128k32n-200p7q as8e128k32p-200/883c as8e128k32p-200/883c we128k32-200h1q we128k32-200h1q act-e128k32c-200p7q act-e128k32c-200p7q we128k32np-200h1q we128k32np-200h1q we128k32-200g1uq we128k32-200g1uq see footnotes at end of table. 3 of 7
standard microcircuit drawing bulletin - continued. date: 02-06-04 standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962-9458504hma 5962-9458504hmc 5962-9458504hma 5962-9458504hmc 5962-9458504hma 5962-9458504hmc 5962-9458504hnc 5962-9458504hta 5962-9458504htc 5962-9458504hua 5962-9458504huc 5962-9458504hxa 5962-9458504hxc 5962-9458504hya 5962-9458504hyc 5962-9458504h4a 5962-9458504h4c 5962-9458504h4a 5962-9458504h4c 5962-9458504h4a 5962-9458504h4c 5962-9458504h5a 5962-9458504h5c 5962-9458504h5a 5962-9458504h5c 5962-9458504h5a 5962-9458504h5c 5962-9458504h6a 5962-9458504h6c 5962-9458504h9a 5962-9458504h9c 0eu86 0eu86 54230 54230 88379 88379 54230 54230 54230 54230 54230 54230 54230 54230 54230 0eu86 0eu86 54230 54230 88379 88379 0eu86 0eu86 54230 54230 88379 88379 54230 54230 54230 54230 as8e128k32q-150/883c as8e128k32q-150/883c we128k32-150g2q we128k32-150g2q act-e128k32n-150f2q act-e128k32n-150f2q we128k32-150g4q we128k32n-150hq we128k32n-150hq we128k32n-150hq we128k32n-150hq we128k32-150hq we128k32-150hq we128k32-150hq we128k32-150hq as8e128k32pn-150/883c as8e128k32pn-150/883c we128k32n-150h1q we128k32n-150h1q act-e128k32n-150p7q act-e128k32n-150p7q as8e128k32p-150/883c as8e128k32p-150/883c we128k32-150h1q we128k32-150h1q act-e128k32c-150p7q act-e128k32c-150p7q we128k32np-150h1q we128k32np-150h1q we128k32-150g1uq we128k32-150g1uq see footnotes at end of table. 4 of 7
standard microcircuit drawing bulletin - continued. date: 02-06-04 standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962-9458505hma 5962-9458505hmc 5962-9458505hma 5962-9458505hmc 5962-9458505hma 5962-9458505hmc 5962-9458505hnc 5962-9458505hta 5962-9458505htc 5962-9458505hua 5962-9458505huc 5962-9458505hxa 5962-9458505hxc 5962-9458505hya 5962-9458505hyc 5962-9458505h4a 5962-9458505h4c 5962-9458505h4a 5962-9458505h4c 5962-9458505h4a 5962-9458505h4c 5962-9458505h5a 5962-9458505h5c 5962-9458505h5a 5962-9458505h5c 5962-9458505h5a 5962-9458505h5c 5962-9458505h6a 5962-9458505h6c 5962-9458505h9a 5962-9458505h9c 0eu86 0eu86 54230 54230 88379 88379 54230 54230 54230 54230 54230 54230 54230 54230 54230 0eu86 0eu86 54230 54230 88379 88379 0eu86 0eu86 54230 54230 88379 88379 54230 54230 54230 54230 as8e128k32q-140/883c as8e128k32q-140/883c we128k32-140g2q we128k32-140g2q act-e128k32n-140f2q act-e128k32n-140f2q we128k32-140g4q we128k32n-140hq we128k32n-140hq we128k32n-140hq we128k32n-140hq we128k32-140hq we128k32-140hq we128k32-140hq we128k32-140hq as8e128k32pn-140/883c as8e128k32pn-140/883c we128k32n-140h1q we128k32n-140h1q act-e128k32n-140p7q act-e128k32n-140p7q as8e128k32p-140/883c as8e128k32p-140/883c we128k32-140h1q we128k32-140h1q act-e128k32c-140p7q act-e128k32c-140p7q we128k32np-140h1q we128k32np-140h1q we128k32-140g1uq we128k32-140g1uq see footnotes at end of table. 5 of 7
standard microcircuit drawing bulletin - continued. date: 02-06-04 standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962-9458506hma 5962-9458506hmc 5962-9458506hma 5962-9458506hmc 5962-9458506hma 5962-9458506hmc 5962-9458506hnc 5962-9458506hta 5962-9458506htc 5962-9458506hua 5962-9458506huc 5962-9458506hxa 5962-9458506hxc 5962-9458506hya 5962-9458506hyc 5962-9458506h4a 5962-9458506h4c 5962-9458506h4a 5962-9458506h4c 5962-9458506h4a 5962-9458506h4c 5962-9458506h5a 5962-9458506h5c 5962-9458506h5a 5962-9458506h5c 5962-9458506h5a 5962-9458506h5c 5962-9458506h6a 5962-9458506h6c 5962-9458506h9a 5962-9458506h9c 0eu86 0eu86 54230 54230 88379 88379 54230 54230 54230 54230 54230 54230 54230 54230 54230 0eu86 0eu86 54230 54230 88379 88379 0eu86 0eu86 54230 54230 88379 88379 54230 54230 54230 54230 as8e128k32q-120/883c as8e128k32q-120/883c we128k32-120g2q we128k32-120g2q act-e128k32n-120f2q act-e128k32n-120f2q we128k32-120g4q we128k32n-120hq we128k32n-120hq we128k32n-120hq we128k32n-120hq we128k32-120hq we128k32-120hq we128k32-120hq we128k32-120hq as8e128k32pn-120/883c as8e128k32pn-120/883c we128k32n-120h1q we128k32n-120h1q act-e128k32n-120p7q act-e128k32n-120p7q as8e128k32p-120/883c as8e128k32p-120/883c we128k32-120h1q we128k32-120h1q act-e128k32c-120p7q act-e128k32c-120p7q we128k32np-120h1q we128k32np-120h1q we128k32-120g1uq we128k32-120g1uq 5962-9458507HMA 5962-9458507hmc 5962-9458507hzc 5962-9458508hma 5962-9458508hmc 5962-9458508hzc 5962-9458509hma 5962-9458509hmc 5962-9458509hzc 0eu86 0eu86 0eu86 0eu86 0eu86 0eu86 0eu86 0eu86 0eu86 as8er128k32q-250/883c as8er128k32q-250/883c as8er128k32qb-250/883c as8er128k32q-200/883c as8er128k32q-200/883c as8er128k32qb-200/883c as8er128k32q-150/883c as8er128k32q-150/883c as8er128k32qb-150/883c see footnotes at top of next page. 6 of 7
standard microcircuit drawing bulletin - continued. date: 02-06-04 1 / the lead finish shown for each pin representing a her metic package is the most readily available from the manufacturer listed for that part. if the desired lead finish is not listed contact the vendor to determine its availability. 2 / caution . do not use this number for it em acquisition. items acquired to this number may not satisfy the performance requirements of this drawing. vendor cage vendor name number and address 0eu86 austin semiconductor, incorporated 8701 cross park drive austin, tx 78754-4566 54230 white electronic designs corporation 3601 east university drive phoenix, az 85034-7217 88379 aeroflex circuit technology corporation 35 south service road plainview, ny 11803-4101 the information contained herein is disseminated for convenience only and the government assumes no liability whatsoever for any inaccuracies in the information bulletin. 7 of 7

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